Title:
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Electro-thermal coupling analysis methodology for RF circuits
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Author:
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Gómez Salinas, Didac; Dufis, Cédric Yvan; Altet Sanahujes, Josep; Mateo Peña, Diego; González Jiménez, José Luis
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Other authors:
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Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
Abstract:
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In this paper an electro-thermal co-simulation methodology suitable for RF circuits is presented. It circumvents traditional transient simulation drawbacks that arise when signals or magnitudes whose frequencies are separated orders of magnitude are present simultaneously in the simulated circuit. The accuracy of the proposed technique is verified experimentally by comparing simulation and measurements of the thermal coupling between an integrated power amplifier (PA) and a differential temperature sensor embedded in the same silicon die, using a 65 nm CMOS technology. |
Abstract:
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Peer Reviewed |
Subject(s):
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-Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica -Microelectronics -CAD tools -Electro-thermal co-simulation -Thermal coupling simulation -RFIC -CMOS -Microelectrònica |
Rights:
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Document type:
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Article - Published version Article |
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