The new fast wire scanner foreseen to measure small emittance beams throughout the LHC injector chain will have a wire travelling at a speed of up to 20 m.s-1, with a requested wire position measurement accuracy in the order of a few microns. The vibration of the thin carbon wires used has been identified as one of the major error sources on the wire position accuracy. One of the most challenging and innovative developments in this project has been the work to quantify the effect of wire vibrations and fork deformation. The measurement strategy for the former is based on the piezo resistive effect of the wire itself, while the deflection of the fork supporting the wire has been measured by semiconductor strain gauges. Dynamic models of the wire and fork have been created to predict the behaviour of the fork-wire assembly and will be used for its optimisation. This contribution will discuss the measurement setup and the model development as well as their comparison. In addition it will show that this technology can easily be implemented in current operating devices without major modifications.