dc.contributor.author
Steeneken, Peter G.
dc.contributor.author
Soikkeli, Miika
dc.contributor.author
Arpiainen, Sanna
dc.contributor.author
Rantala, Arto
dc.contributor.author
Jaaniso, Raivo
dc.contributor.author
Pezone, Roberto
dc.contributor.author
Vollebregt, Sten
dc.contributor.author
Lukas, Sebastian
dc.contributor.author
Kataria, Satender
dc.contributor.author
Houmes, Maurits J. A.
dc.contributor.author
Álvarez Diduk, Ruslan
dc.contributor.author
Lee, Kangho
dc.contributor.author
Suryo Wasisto, Hutomo
dc.contributor.author
Anzinger, Sebastian
dc.contributor.author
Fueldner, Marc
dc.contributor.author
Verbiest, Gerard J.
dc.contributor.author
Alijani, Farbod
dc.contributor.author
Hoon Shin, Dong
dc.contributor.author
Malic, Ermin
dc.contributor.author
van Rijn, Richard
dc.contributor.author
Nevanen, Tarja K.
dc.contributor.author
Centeno, Alba
dc.contributor.author
Zurutuza, Amaia
dc.contributor.author
van der Zant, Herre S. J.
dc.contributor.author
Merkoçi, Arben
dc.contributor.author
Duesberg, Georg S.
dc.contributor.author
Lemme, Max C.
dc.date.accessioned
2025-05-08T16:47:44Z
dc.date.available
2025-05-08T16:47:44Z
dc.identifier
https://ddd.uab.cat/record/310025
dc.identifier
urn:10.1088/2053-1583/adac73
dc.identifier
urn:oai:ddd.uab.cat:310025
dc.identifier
urn:icn2uab:6728042
dc.identifier
urn:scopus_id:85217926559
dc.identifier
urn:articleid:20531583v12n2p23002
dc.identifier.uri
https://hdl.handle.net/2072/483871
dc.description.abstract
The unique properties of two-dimensional (2D) materials bring great promise to improve sensor performance and realise novel sensing principles. However, to enable their high-volume production, wafer-scale processes that allow integration with electronic readout circuits need to be developed. In this perspective, we review recent progress in on-chip 2D material sensors, and compare their performance to the state-of-the-art, with a focus on results achieved in the Graphene Flagship programme. We discuss transfer-based and transfer-free production flows and routes for complementary metal-oxide-semiconductor integration and prototype development. Finally, we give an outlook on the future of 2D material sensors, and sketch a roadmap towards realising their industrial and societal impact.
dc.format
application/pdf
dc.relation
European Commission 881603
dc.relation
Agencia Estatal de Investigación CEX2021-001214-S
dc.relation
2D materials ; Vol. 12, Issue 2 (April 2025), art. 23002
dc.rights
Aquest document està subjecte a una llicència d'ús Creative Commons. Es permet la reproducció total o parcial, la distribució, la comunicació pública de l'obra i la creació d'obres derivades, fins i tot amb finalitats comercials, sempre i quan es reconegui l'autoria de l'obra original.
dc.rights
https://creativecommons.org/licenses/by/4.0/
dc.title
Towards wafer-scale 2D material sensors