Mechanical and microstructural characterization of new nickel-free low modulus beta-type titanium wires during thermomechanical treatments

Author

Guillem Martí, Jordi

Herranz-Diez, Carolina

Shaffer, J.E.

Gil Mur, Francisco Javier

Manero Planella, José María

Publication date

2015-06-11



Abstract

NiTi alloy is the only practical shape memory alloy (SMA) in biomedical use because of its excellent mechanical stability and functionality. However, it is estimated that between 4.5% and 28.5% of the population are hypersensitive to nickel metal, with a higher prevalence in females. Therefore, developing nickel-free low modulus beta-type titanium alloys showing shape memory or super elastic behavior would have a great interest in the biomaterials field. Homogeneous 127 mu m diameter Ti25Hf21Nb wires were produced and compared to straight annealed Ti-50.8 at% Ni (Nitinol) and 90% cold-drawn 316L wires. Microstructural changes taking place during the heat treatment of cold-worked Ti25Hf21Nb wires were investigated. Large plastic deformation during wire drawing and subsequent annealing led to nano-crystallization and amorphization which may contribute to the observed superelasticity. Mechanical properties were characterized using cyclic uniaxial tension and rotary beam fatigue test modes. A modulus of elasticity of less than 60 GPa and axial recoverable strain of greater than 3% were observed with stress hysteresis resembling a reversible stress-induced martensitic transformation at higher temperatures. The new Ti25Hf21Nb alloy is an important candidate for developing Ni-free SMAs in the future.

Document Type

Article

Document version

Accepted version

Language

English

CDU Subject

62 - Engineering. Technology in general

Subjects and keywords

Aliatges; Elasticitat; Materials biomèdics; Titani -- Aliatges; Aleaciones; Elasticidad; Materiales biomédicos; Titanio -- Aleaciones; Alloys; Elasticity; Biomedical materials; Titanium alloys

Pages

33

Publisher

Elsevier

Collection

636;

Version of

Materials Science and Engineering: A

Rights

© 2015 Elsevier B.V. All rights reserved.

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