To access the full text documents, please follow this link: http://hdl.handle.net/2445/8745
dc.contributor | Universitat de Barcelona |
---|---|
dc.contributor.author | Palacín Roca, Jordi |
dc.contributor.author | Salleras, Marc |
dc.contributor.author | Samitier i Martí, Josep |
dc.contributor.author | Marco Colás, Santiago |
dc.date | 2009-06-19T07:43:33Z |
dc.date | 2009-06-19T07:43:33Z |
dc.date | 2005 |
dc.identifier.citation | 1521-3323 |
dc.identifier.citation | 517594 |
dc.identifier.uri | http://hdl.handle.net/2445/8745 |
dc.format | 10 p. |
dc.format | application/pdf |
dc.language.iso | eng |
dc.publisher | IEEE |
dc.relation | Reproducció del document publicat a http://dx.doi.org/10.1109/TADVP.2005.850507 |
dc.relation | IEEE Transactions on Advanced Packaging, 2005, vol. 28, núm. 4, p. 694-703. |
dc.relation | http://dx.doi.org/10.1109/TADVP.2005.850507 |
dc.rights | (c) IEEE, 2005 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Microelectrònica |
dc.subject | Dynamic compact thermal models |
dc.subject | Modeling |
dc.subject | Thin electronics |
dc.title | Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technology |
dc.type | info:eu-repo/semantics/article |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.description.abstract |