Exploration of intercell wireless millimeter-wave communication in the landscape of intelligent metasurfaces

Otros/as autores/as

Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors

Universitat Politècnica de Catalunya. Doctorat en Arquitectura de Computadors

Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica

Universitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla

Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits

Fecha de publicación

2019-01-01

Resumen

Software-defined metasurfaces are electromagnetically ultra-thin, artificial components thatcan provide engineered and externally controllable functionalities. The control over these functionalities isenabled by the metasurface tunability, which is implemented by embedded electronic circuits that modifylocally the surface resistance and reactance. Integrating controllers within the metasurface able them tointercommunicate and adaptively reconfigure, thus imparting a desired electromagnetic operation, opens thepath towards the creation of an artificially intelligent (AI) fabric where each unit cell can have its own sensing,programmable computing, and actuation facilities. In this work we take a crucial step towards bringing theAI metasurface technology to emerging applications, in particular exploring the wireless mm-wave intercellcommunication capabilities in a software-defined HyperSurface designed for operation in the microwaveregime. We examine three different wireless communication channels within the landscape of the reflectivemetasurface: Firstly, in the layer where the control electronics of the HyperSurface lie, secondly inside adedicated layer enclosed between two metallic plates, and, thirdly, inside the metasurface itself. For each casewe examine the physical implementation of the mm-wave transceiver nodes, we quantify communicationchannel metrics, and we identify complexity vs. performance trade-offs.


Peer Reviewed


Postprint (published version)

Tipo de documento

Article

Lengua

Inglés

Publicado por

Institute of Electrical and Electronics Engineers (IEEE)

Documentos relacionados

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8788546

info:eu-repo/grantAgreement/EC/H2020/736876/EU/VisorSurf/VISORSURF

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Derechos

Open Access

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