Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
Barcelona Supercomputing Center
Universitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
2016
System reliability has become a key design aspect for computer systems due to the aggressive technology miniaturization. Errors are typically dominated by transient faults due to radiation and are strongly related to the technology used to build hardware. However, there is a lack of detailed methodologies to model and fairly compare Soft Error Rates (SER) across different advanced technologies. This work first describes a common methodology that from (1) technology models, (2) location (latitude, longitude and altitude), (3) operating conditions and (4) circuit descriptions (i.e. SRAM, latches, logic gates) can obtain accurate Soft Error Rates. Then, we use it to characterize soft errors through current and future technologies. Results at the technology layer show that new technologies, such as FinFET and SOI, can reduce SER up to 100x while the location can increase SER up to 650x. © 2016 EDAA.
This work has been partially supported by the Spanish Ministry of Education and Science under grant TIN2013-44375-R and the FP7 program of the EU under contract FP7-611404 (CLERECO). Jaume Abella has been partially supported by the Ministry of Economy and Competitiveness under Ramon y Cajal postdoctoral fellowship number RYC-2013-14717.
Peer Reviewed
Postprint (published version)
Conference report
Anglès
Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats; Àrees temàtiques de la UPC::Informàtica; Integrated circuits; Software engineering; Error correction; Radiation hardening; Reconfigurable hardware; Advanced technology; Circuit description; Future technologies; Operating condition; Soft error rate; System reliability; Through current; Transient faults; Circuits integrats; Enginyeria de programari
Institute of Electrical and Electronics Engineers (IEEE)
http://ieeexplore.ieee.org/document/7459307/
info:eu-repo/grantAgreement/MINECO//TIN2013-44375-R/ES/MICROARQUITECTURA Y COMPILADORES PARA FUTUROS PROCESADORES III/
info:eu-repo/grantAgreement/EC/FP7/611404/EU/Cross-Layer Early Reliability Evaluation for the Computing cOntinuum/CLERECO
info:eu-repo/grantAgreement/MINECO//RYC-2013-14717/ES/RYC-2013-14717/
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